The Design cluster is specialized in the research and development of high-speed and high-frequency electronic circuits, subsystems and system demonstrators on chip and board level. This know-how and expertise is applied to the physical layer of several advanced wired, wireless and instrumentation applications, such as: 

• Fiber-optic datacenter, access, metro, radio-over-fiber and transport networks 
• Short-reach copper interconnects for chip-to-chip, chip-to-module, backplane and cable backplane links 
• Wireless communication for 5G and the internet of things 
• Instrumentation and measurement electronics for monitoring and controlling the physical layer of communications networks and for medical applications