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Physical Layer Design

The Design cluster is specialized in the research and development of high-speed and high-frequency electronic circuits, subsystems and system demonstrators on chip and board level. This know-how and expertise is applied to the physical layer of several advanced wired, wireless and instrumentation applications, such as: 

  • Fiber-optic datacenter, access, metro, radio-over-fiber and transport networks 
  • Short-reach copper interconnects for chip-to-chip, chip-to-module, backplane and cable backplane links 
  • Wireless communication for 5G and the internet of things 
  • Instrumentation and measurement electronics for monitoring and controlling the physical layer of communications networks and for medical applications  

Research coordinators

Johan Bauwelinck, Xin Yin, Guy Torfs

Research topics

  • Fiber-optic TRx circuits, subsystems and test beds
  • Short-reach copper interconnect TRx circuits, subsystems and test beds
  • Wireless TRx circuits, subsystems and test beds
  • Instrumentation and measurement electronics

 

 

 

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