- About IBCN
- Members
- Research
- Network Modeling, Design and Evaluation
- Mobile and Wireless Networking
- High Performance Multimedia Processing
- Autonomic Computing and Networking
- Service Engineering
- Content Management and Search
- Data Analysis en Machine Learning
- Information Extraction and Retrieval
- Electromagnetics
- Physical Layer Design
- Application Domains
- Publications
- Projects
- Education
- Facilities and Tools
Physical Layer Design
The Design cluster is specialized in the research and development of high-speed and high-frequency electronic circuits, subsystems and system demonstrators on chip and board level. This know-how and expertise is applied to the physical layer of several advanced wired, wireless and instrumentation applications, such as:
- Fiber-optic datacenter, access, metro, radio-over-fiber and transport networks
- Short-reach copper interconnects for chip-to-chip, chip-to-module, backplane and cable backplane links
- Wireless communication for 5G and the internet of things
- Instrumentation and measurement electronics for monitoring and controlling the physical layer of communications networks and for medical applications